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US Patent Issued to Panasonic Intellectual Property Management on Feb. 3 for "Information processing apparatus and method" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,541,926, issued on Feb. 3, was assigned to Panasonic Intellectual Property Management Co. Ltd. (Osaka, Japan). "Information processing apparatus... Read More


US Patent Issued to LG INNOTEK on Feb. 3 for "Systems and methods for clock-skew search to improve depth accuracy in Geiger mode lidar" (Washington, New Jersey Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,541,028, issued on Feb. 3, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea). "Systems and methods for clock-skew search to improve depth... Read More


US Patent Issued to Battelle Memorial Institute on Feb. 3 for "Firearm discharge location systems and associated methods" (Washington Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,541,025, issued on Feb. 3, was assigned to Battelle Memorial Institute (Richland, Wash.). "Firearm discharge location systems and associated met... Read More


US Patent Issued to Apple on Feb. 3 for "Low-bandwidth and emergency communication user interfaces" (California Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,028, issued on Feb. 3, was assigned to Apple Inc. (Cupertino, Calif.). "Low-bandwidth and emergency communication user interfaces" was inven... Read More


US Patent Issued to DENSELIGHT SEMICONDUCTORS on Feb. 3 for "Mode field adapter for optical coupling of waveguides" (Singaporean Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,541,056, issued on Feb. 3, was assigned to DENSELIGHT SEMICONDUCTORS PTE LTD (Singapore). "Mode field adapter for optical coupling of waveguides... Read More


US Patent Issued to Intel on Feb. 3 for "Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems" (Arizona, Iowa Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,542,358, issued on Feb. 3, was assigned to Intel Corp. (Santa Clara, Calif.). "Microelectronic devices designed with mold patterning to create p... Read More


US Patent Issued to TEXAS INSTRUMENTS on Feb. 3 for "Alloy for metal undercut reduction" (Philippine Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,588, issued on Feb. 3, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Alloy for metal undercut reduction" was invented by Rafael Jose Gue... Read More


US Patent Issued to TEQCool on Feb. 3 for "Removable liquid heat exchanging element for use in a device for temperature control treatment" (Swedish Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,539,231, issued on Feb. 3, was assigned to TEQCool AB (Lund, Sweden). "Removable liquid heat exchanging element for use in a device for temperat... Read More


US Patent Issued to Huawei Technologies on Feb. 3 for "Handling trailing bits in arithmetic encoding and decoding" (German, Russian Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,542,904, issued on Feb. 3, was assigned to Huawei Technologies Co. Ltd. (Shenzhen, China). "Handling trailing bits in arithmetic encoding and de... Read More


US Patent Issued to DELL PRODUCTS on Feb. 3 for "Method and apparatus for wide entropy authenticated encryption design with bi-lateral linear-feedback shift register hash function input stream for wireless input/output device communications" (Singaporean, American, Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,542,652, issued on Feb. 3, was assigned to DELL PRODUCTS LP (Round Rock, Texas). "Method and apparatus for wide entropy authenticated encryption... Read More